HYSOL KLGR640HV-L1電子膠水/塑封膠水/漢高樂泰膠水/塑封方案
技術(shù)服務(wù)熱線:021-51693135 / 021-22818476
Product HYSOL GR640HV-L1 Description Low stress plasticizer for SOT, SOD package.
With good processing performance and high stability and minimum cost of ownership. Suitable for high pressure applications.
Thermal conductivity 0.8 W / mK MSL L1 / 260 ° C Linear flow, cm 58 Hot plate gel time, seconds 23 Filling content% 75 CTEa1, ppM / ° C 16 Tg, ° C 158 Main features Suitable for high pressure applications.
產(chǎn)品HYSOL GR640HV-L1 描述 低應(yīng)力塑封料,適用于 SOT、SOD 封裝。
具 有良好加工性能和高穩(wěn)定性及*低擁有成本。
適用于高壓應(yīng)用。 導(dǎo)熱率0.8 W/mK MSL L1/260℃ 線性流 動(dòng),厘米58 熱板凝膠 時(shí)間,秒23 填充含 量 % 75 CTEa1, ppM/℃ 16 Tg, ℃ 158
主要特點(diǎn) 適合于高壓應(yīng)用。 |