漢高漢高 樂(lè)泰樂(lè)泰 貼片紅膠 Chipbond 3609
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂(lè)泰 3609
樂(lè)泰 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. 樂(lè)泰 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.2
Particle Size, μm <150
Flash Point - See SDS
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 700LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
0.16 to 2.0
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity curve as measured using a Haake rotoviscometer PK100, M10/PK1 2° Cone system at a shear rate of 2 s -1 which is representative of the shear rate in the dispense nozzle. Increased cabin or nozzle temperature in the 30°C to 35°C range may aid dispense performance at higher dispense spee |
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